HC32F003C4PB

XHSC· Series HC32F003Lifecycle: Not stated

Cortex-M0+ · 32 MHz · 16 KB · 2 KB · 1.8 ~ 5.5 V · TSSOP20

HC32F003C4PB-TSSOP20
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Key specifications

CPU core
Cortex-M0+
Max CPU frequency
32 MHz
Program Flash
16 KB
SRAM
2 KB
Operating voltage
1.8 ~ 5.5 V
Operating temperature
-40 ~ 105°C
Package
TSSOP20
GPIO count
16
UART
2
SPI
1
I²C
1
ADC resolution
12
ADC channels
9

All parameters

Core
CPU coreCortex-M0+
Max CPU frequency32 MHz
Memory
Program Flash16 KB
SRAM2 KB
Power & environment
Operating voltage1.8 ~ 5.5 V
Operating temperature-40 ~ 105°C
Run current per MHz150 µA/MHz
Run mode (CPU and peripherals running, code executed from Flash), VDD=3V, 16MHz, typical at room temperature
Lowest-power mode current0.46 µA
DeepSleep mode, all peripherals clock OFF (WDT off), VCAP=1.55V, VDD=1.8-5.5V (typ measured at VCC=3.3V), TA=-40~25°C, typ
Package & IO
PackageTSSOP20
Pin count20
GPIO count16
Connectivity
UART2
SPI1
I²C1
Analog
ADC resolution12
ADC channels9
ADC sample rate1 MSPS
Analog comparators2
Temperature sensorYes
Reliability
ESD (HBM)4 kV
Human Body Model, typ
Flash endurance100,000 cycles
program / sector erase cycles, typ, TA=-40~105°C, with data retention 10 years at TA=85°C
Flash data retention10 years
TA=85°C, paired with 100000 program/erase cycles (typ)

Values are read by software from the exact location in the manufacturer's document and cross-checked. The latest manufacturer datasheet prevails.

Same series (2)

PNMax CPU frequencyProgram FlashSRAMOperating temperaturePackageGPIO count
HC32F003C4PA32 MHz16 KB2 KB-40 ~ 85°CTSSOP2016
HC32F003C4UA32 MHz16 KB2 KB-40 ~ 85°CQFN2016